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  Encyclopedia of Keywords > Nature > Matter > Materials > Semiconductor > Wafer   Michael Charnine

Keywords and Sections
FLAKY
TENSION WRENCH
WAFER 200
FRONT SIDE
WAFER THIN SHELLS
SEMICONDUCTOR MATERIAL 12
SINGLE CRYSTAL SILICON WAFER
BACK SURFACE
MONOCRYSTALLINE SILICON WAFER
THIN SLICE
WAFER LOCKS
WAFER PLATE
FOCUS
GIVING
PRIOR
MASK
THICKNESS
CENTER
MANNER
NITROGEN
COIN
RESULT
CARRYING
PATTERNS
DEVICE
PRIEST
FLUID
PLASMA
CHAMBER
EUCHARIST
PRECURSOR FLUID
LAYERS
PLURALITY
ARSENIC
PRECIOUS METAL
METHOD
CONTACTING
HARDENED
METAL
SHEET
BONDING
MANUFACTURING PROCESS
SOLAR CELLS
SEMICONDUCTOR MATERIAL
DIAMOND
SILICON DIOXIDE
Review of Short Phrases and Links

    This Review contains major "Wafer"- related terms, short phrases and links grouped together in the form of Encyclopedia article.

Definitions

  1. A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices.
  2. A wafer is made out of extremely purified silicon that is grown into mono-crystalline cylindrical ingots, using the Czochralski process.
  3. The wafer is then diced into many small pieces, and electrical contacts are attached to the front and back sides of the pieces to form the individual LEDs.
  4. The wafer is placed in a diffusion furnace which will be filled with gaseous compounds (all n- type dopants), for a process known as impurity doping.
  5. The wafer is exposed to a gaseous P-type dopant at high temperature in a diffusion furnace (j).

Flaky

  1. Papoŗ(papadum), a type of wafer, thin and flaky, is often made of đal or potatoes or shabu (tapioca) and is a usual accompaniment to the chutneys.

Tension Wrench

  1. If the tumblers (pin or wafer) will not break, or stay broken, you are going in the wrong direction with the tension wrench.

Wafer 200

  1. With reference to FIG. 2, for one embodiment, a semiconductor die 210 is produced from a wafer 200.

Front Side

  1. To make a solar cell from the wafer, a surface diffusion of n-type dopants is performed on the front side of the wafer.
  2. The semiconductor wafer has a front side with an adjoining near-surface active zone as basic material for semiconductor component structures.

Wafer Thin Shells

  1. Porcelain veneers are wafer thin shells of porcelain, specially shaped which are 'bonded' (cemented) onto the front side of teeth.

Semiconductor Material 12

  1. The semiconductor material 12 may be the surface semiconductor layer of a semiconductor-on-insulator (SOI) wafer.
  2. More specifically, the semiconductor material 12 may be a surface semiconductor layer of an SOI wafer.

Single Crystal Silicon Wafer

  1. SOI wafers have a thin layer of silicon dioxide below the surface of the single crystal silicon wafer.

Back Surface

  1. This implantation step is the first step provided for forming microvoids in the semiconductor substrate 1 at the back surface layer 4 of the wafer 2.
  2. When this happens, a thin film 205 of water vapor adsorbs on the back surface of the wafer 200.

Monocrystalline Silicon Wafer

  1. In this embodiment, the semiconductor substrate is a monocrystalline silicon wafer having a 200 millimeter diameter.

Thin Slice

  1. A wafer is a thin slice of semiconductor used to create complicated circuits and other devices.

Wafer Locks

  1. As a rule, though, wafer locks need less play with the tension wrench than with pin tumbler locks.

Wafer Plate

  1. The ion implantation target chamber is configured to implant an ion species into a semiconductor wafer on a currently loaded wafer plate.
  2. As such, it may be necessary to open the ion implantation target chamber to unload the current wafer plate and load the next wafer plate into the chamber.

Focus

  1. A focusing sensor was developed to focus a 110 GHz millimeter wave beam on the surface of a silicon wafer.

Giving

  1. Some dopants are generally added as the (usually silicon) boule is grown, giving each wafer an almost uniform initial doping.

Prior

  1. The back surface of the semiconductor wafer is pre-treated for the formation of gettering sites, prior to the wafer front polishing step.

Mask

  1. The quartz clips may also mask a significant area of the semiconductor wafer to be implanted.
  2. Figure 11 depicts a mask used to transfer the desired pattern onto the silicon wafer.

Thickness

  1. So when a larger diameter semiconductor is needed, the thickness of the wafer must also increase, increasing cost.
  2. The starting material is a diffused silicon wafer with a thickness of about 0.3 mm.

Center

  1. The wafer has a hole cut through the center, which fits over the anal opening.

Manner

  1. In this manner, every pulse of the precursor fluid forms a very thin layer on the semiconductor wafer.
  2. Dopant ions that are implanted in this manner often disrupt the silicon lattice structure of the silicon wafer.

Nitrogen

  1. The spin dry solution can be accomplished in nitrogen using a single wafer or batch tool.
  2. After the semiconductor wafer 14 is provided in the vacuum chamber 12, an internal atmosphere of the vacuum chamber 12 is substituted with nitrogen.

Coin

  1. A gold wafer in round form, resembling a coin.

Result

  1. As a result, the electronic conductance of the wafer is rendered unpredictable, and the dopant ions may be positioned in isolation of the electronic flow.

Carrying

  1. A robot (15) is used to transfer a chuck (8) carrying a semiconductor wafer between a cassette (10) and laser interferometer mirror assembly (13).

Patterns

  1. The masks are used in the photolithography process to transfer the patterns to the silicon wafer.
  2. The patterns are computerized designs that are miniaturized so that up to several hundred microprocessors can be put on a single wafer.

Device

  1. A solar cell, made from a monocrystalline silicon wafer A solar cell or photovoltaic cell is a device that converts light energy into electrical energy.

Priest

  1. The National Post ran a front-page editorial cartoon depicting the prime minister saying “No Thanks, I've Eaten,” as the priest is handing him the wafer.
  2. Catholics believe the Communion wafer is transformed into the body of Christ by the priest during Mass.

Fluid

  1. When the precursor is pulsed into the chamber, the fluid reacts with the semiconductor wafer which is at a elevated temperature.

Plasma

  1. Thereafter, a plasma ashing step is conducted (typically using an oxygen based plasma) in which the remaining resist is removed from the wafer.

Chamber

  1. After the reaction chamber is purged with an inert gas, the solid layer formed on the semiconductor wafer is then annealed using light energy.
  2. I do not know who awaits me in the upper chamber, although I now know that whoever it is will half expect me to be carrying a wafer.
  3. In this manner, the walls of the chamber are maintained at a lower temperature than the semiconductor wafer 22 during a heating cycle.

Eucharist

  1. See "Eucharist" and "wafer." House of Bishops All the bishops of the Episcopal church sitting as a legislative and judiciary body of the church.

Precursor Fluid

  1. After each pulse of the precursor fluid, the amount of light energy emitted into the wafer is then decreased.
  2. The fluid input is configured to dispose a precursor fluid to a non-Newtonian fluid on the semiconductor wafer to be supported within the chamber.

Layers

  1. Adding epitaxial layers 4 Additional layers of semiconductor crystal are grown on the surface of the wafer, like adding more layers to the cake.
  2. Chip assembly is a painstaking process in which layers of different materials are deposited on a wafer of silicon, and patterns are etched into them.

Plurality

  1. The plurality of semiconductor wafers comprises a first semiconductor wafer and a second semiconductor wafer.
  2. The plurality of wire clips may be configured to removably attach the at least one semiconductor wafer to the wafer plate adjacent to the opening.

Arsenic

  1. With the produced silicon atoms and arsenic atoms deposited on the semiconductor wafer 14, a silicon thin film including arsenic is formed.

Precious Metal

  1. Precious metal in negotiable or tradable form, such as a wafer or bar.

Method

  1. The method also includes an operation for disposing the precursor fluid on the semiconductor wafer while maintaining the precursor fluid in the liquid state.
  2. In one embodiment, the semiconductor wafer 101 can be subjected to a rinse and dry procedure prior to performing the method of FIG. 2.

Contacting

  1. The perforated plate can include a plurality of holes through which the fluid is directed prior to contacting the wafer.

Hardened

  1. All bronze age sword edges were hardened and sharpened at the same time, the edges were forged down to a thin, hard wafer.

Metal

  1. The BEOL process generally begins when the first layer of metal is deposited on the wafer.
  2. BEOL generally begins when the first layer of metal is deposited on the wafer.
  3. The complex, interconnected, metal lines on today's integrated circuits begin as a metallic thin-film layer, deposited on the top of a silicon wafer.

Sheet

  1. A sheet of semiconductor wafer is generally 3 inches, 5 inches or 6 inches across.

Bonding

  1. In semiconductor industry, a die collet is used for picking a die up from a wafer after die cutting process has finished, and bonding it into a package.

Manufacturing Process

  1. The Manufacturing Process Making semiconductor wafers 1 First, a semiconductor wafer is made.

Solar Cells

  1. Thin-film solar cells use less than 1% of the raw material (silicon) compared to wafer based solar cells, leading to a significant price drop per kWh.

Semiconductor Material

  1. Wafer - A thin sheet of semiconductor material made by mechanically sawing it from a single-crystal or multicrystal ingot or casting.

Diamond

  1. As sapphire does not cleave easily, the wafer must be diced into individual LEDs using a diamond saw.

Silicon Dioxide

  1. A silicon dioxide layer (b) is grown atop the wafer in the presence of oxygen or water vapor at high temperature (over 1000 o C in a diffusion furnace.
  2. The end result is an added layer of silicon dioxide (SiO2), "grown" on the surface of the wafer.
  3. The silicon wafer is etched to create trenches that are filled with an isolating material such as silicon dioxide.

Categories

  1. Nature > Matter > Materials > Semiconductor
  2. Nature > Matter > Atoms > Silicon
  3. Energy > Electricity > Electronics > Integrated Circuits
  4. Substrate
  5. Thin

Related Keywords

    * Diodes * Dopant * Doping * Electronic Devices * Embodiment * Fabrication * Form * Gaas * Impurities * Integrated Circuits * Light * Material * Materials * Overlay * Present Invention * Process * Semiconductor * Semiconductor Devices * Semiconductor Wafer * Silicon * Silicon Wafer * Substrate * Surface * Thin * Tooth
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  Short phrases about "Wafer"
  Originally created: April 04, 2011.
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