Review of Short Phrases and Links|
This Review contains major "Wafer"- related terms, short phrases and links grouped together in the form of Encyclopedia article.
- A wafer is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other microdevices.
- A wafer is made out of extremely purified silicon that is grown into mono-crystalline cylindrical ingots, using the Czochralski process.
- The wafer is then diced into many small pieces, and electrical contacts are attached to the front and back sides of the pieces to form the individual LEDs.
- The wafer is placed in a diffusion furnace which will be filled with gaseous compounds (all n- type dopants), for a process known as impurity doping.
- The wafer is exposed to a gaseous P-type dopant at high temperature in a diffusion furnace (j).
- Papoŗ(papadum), a type of wafer, thin and flaky, is often made of đal or potatoes or shabu (tapioca) and is a usual accompaniment to the chutneys.
- If the tumblers (pin or wafer) will not break, or stay broken, you are going in the wrong direction with the tension wrench.
- With reference to FIG. 2, for one embodiment, a semiconductor die 210 is produced from a wafer 200.
- To make a solar cell from the wafer, a surface diffusion of n-type dopants is performed on the front side of the wafer.
- The semiconductor wafer has a front side with an adjoining near-surface active zone as basic material for semiconductor component structures.
- Porcelain veneers are wafer thin shells of porcelain, specially shaped which are 'bonded' (cemented) onto the front side of teeth.
- The semiconductor material 12 may be the surface semiconductor layer of a semiconductor-on-insulator (SOI) wafer.
- More specifically, the semiconductor material 12 may be a surface semiconductor layer of an SOI wafer.
- SOI wafers have a thin layer of silicon dioxide below the surface of the single crystal silicon wafer.
- This implantation step is the first step provided for forming microvoids in the semiconductor substrate 1 at the back surface layer 4 of the wafer 2.
- When this happens, a thin film 205 of water vapor adsorbs on the back surface of the wafer 200.
- In this embodiment, the semiconductor substrate is a monocrystalline silicon wafer having a 200 millimeter diameter.
- A wafer is a thin slice of semiconductor used to create complicated circuits and other devices.
- As a rule, though, wafer locks need less play with the tension wrench than with pin tumbler locks.
- The ion implantation target chamber is configured to implant an ion species into a semiconductor wafer on a currently loaded wafer plate.
- As such, it may be necessary to open the ion implantation target chamber to unload the current wafer plate and load the next wafer plate into the chamber.
- A focusing sensor was developed to focus a 110 GHz millimeter wave beam on the surface of a silicon wafer.
- Some dopants are generally added as the (usually silicon) boule is grown, giving each wafer an almost uniform initial doping.
- The back surface of the semiconductor wafer is pre-treated for the formation of gettering sites, prior to the wafer front polishing step.
- The quartz clips may also mask a significant area of the semiconductor wafer to be implanted.
- Figure 11 depicts a mask used to transfer the desired pattern onto the silicon wafer.
- So when a larger diameter semiconductor is needed, the thickness of the wafer must also increase, increasing cost.
- The starting material is a diffused silicon wafer with a thickness of about 0.3 mm.
- The wafer has a hole cut through the center, which fits over the anal opening.
- In this manner, every pulse of the precursor fluid forms a very thin layer on the semiconductor wafer.
- Dopant ions that are implanted in this manner often disrupt the silicon lattice structure of the silicon wafer.
- The spin dry solution can be accomplished in nitrogen using a single wafer or batch tool.
- After the semiconductor wafer 14 is provided in the vacuum chamber 12, an internal atmosphere of the vacuum chamber 12 is substituted with nitrogen.
- A gold wafer in round form, resembling a coin.
- As a result, the electronic conductance of the wafer is rendered unpredictable, and the dopant ions may be positioned in isolation of the electronic flow.
- A robot (15) is used to transfer a chuck (8) carrying a semiconductor wafer between a cassette (10) and laser interferometer mirror assembly (13).
- The masks are used in the photolithography process to transfer the patterns to the silicon wafer.
- The patterns are computerized designs that are miniaturized so that up to several hundred microprocessors can be put on a single wafer.
- A solar cell, made from a monocrystalline silicon wafer A solar cell or photovoltaic cell is a device that converts light energy into electrical energy.
- The National Post ran a front-page editorial cartoon depicting the prime minister saying “No Thanks, I've Eaten,” as the priest is handing him the wafer.
- Catholics believe the Communion wafer is transformed into the body of Christ by the priest during Mass.
- When the precursor is pulsed into the chamber, the fluid reacts with the semiconductor wafer which is at a elevated temperature.
- Thereafter, a plasma ashing step is conducted (typically using an oxygen based plasma) in which the remaining resist is removed from the wafer.
- After the reaction chamber is purged with an inert gas, the solid layer formed on the semiconductor wafer is then annealed using light energy.
- I do not know who awaits me in the upper chamber, although I now know that whoever it is will half expect me to be carrying a wafer.
- In this manner, the walls of the chamber are maintained at a lower temperature than the semiconductor wafer 22 during a heating cycle.
- See "Eucharist" and "wafer." House of Bishops All the bishops of the Episcopal church sitting as a legislative and judiciary body of the church.
- After each pulse of the precursor fluid, the amount of light energy emitted into the wafer is then decreased.
- The fluid input is configured to dispose a precursor fluid to a non-Newtonian fluid on the semiconductor wafer to be supported within the chamber.
- Adding epitaxial layers 4 Additional layers of semiconductor crystal are grown on the surface of the wafer, like adding more layers to the cake.
- Chip assembly is a painstaking process in which layers of different materials are deposited on a wafer of silicon, and patterns are etched into them.
- The plurality of semiconductor wafers comprises a first semiconductor wafer and a second semiconductor wafer.
- The plurality of wire clips may be configured to removably attach the at least one semiconductor wafer to the wafer plate adjacent to the opening.
- With the produced silicon atoms and arsenic atoms deposited on the semiconductor wafer 14, a silicon thin film including arsenic is formed.
- Precious metal in negotiable or tradable form, such as a wafer or bar.
- The method also includes an operation for disposing the precursor fluid on the semiconductor wafer while maintaining the precursor fluid in the liquid state.
- In one embodiment, the semiconductor wafer 101 can be subjected to a rinse and dry procedure prior to performing the method of FIG. 2.
- The perforated plate can include a plurality of holes through which the fluid is directed prior to contacting the wafer.
- All bronze age sword edges were hardened and sharpened at the same time, the edges were forged down to a thin, hard wafer.
- The BEOL process generally begins when the first layer of metal is deposited on the wafer.
- BEOL generally begins when the first layer of metal is deposited on the wafer.
- The complex, interconnected, metal lines on today's integrated circuits begin as a metallic thin-film layer, deposited on the top of a silicon wafer.
- A sheet of semiconductor wafer is generally 3 inches, 5 inches or 6 inches across.
- In semiconductor industry, a die collet is used for picking a die up from a wafer after die cutting process has finished, and bonding it into a package.
- The Manufacturing Process Making semiconductor wafers 1 First, a semiconductor wafer is made.
- Thin-film solar cells use less than 1% of the raw material (silicon) compared to wafer based solar cells, leading to a significant price drop per kWh.
- Wafer - A thin sheet of semiconductor material made by mechanically sawing it from a single-crystal or multicrystal ingot or casting.
- As sapphire does not cleave easily, the wafer must be diced into individual LEDs using a diamond saw.
- A silicon dioxide layer (b) is grown atop the wafer in the presence of oxygen or water vapor at high temperature (over 1000 o C in a diffusion furnace.
- The end result is an added layer of silicon dioxide (SiO2), "grown" on the surface of the wafer.
- The silicon wafer is etched to create trenches that are filled with an isolating material such as silicon dioxide.
- Nature > Matter > Materials > Semiconductor
- Nature > Matter > Atoms > Silicon
- Energy > Electricity > Electronics > Integrated Circuits
* Electronic Devices
* Integrated Circuits
* Present Invention
* Semiconductor Devices
* Semiconductor Wafer
* Silicon Wafer
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